Epoxy resin adhesive film for bonding prepregs to honeycomb cores, foam cores and metallic components.
SIGRAPREG® F 147-E322/100 % is placed between the materials to be bonded and cured under heat and pressure. The film contains 147 g/m² of epoxy resin and provides a defined resin addition within the component lay-up.
SIGRAPREG® F 147-E322/100 % is a thin epoxy resin adhesive film for processing under heat and pressure. The adhesive film is placed between the materials to be bonded. When heated, the resin becomes flowable, wets the adjacent surfaces and subsequently cures.
Typical applications include sandwich and hybrid components in which prepregs are bonded to honeycomb cores, foam cores or metallic components.
Typical applications
Prepreg with honeycomb or foam core
The adhesive film is placed between the prepreg and the core material.
Typical lay-up:
Prepreg → Epoxy resin film → Honeycomb core or foam core → Epoxy resin film → Prepreg
The film forms the resin or adhesive layer between the facing and the core material.
Prepreg with metal
SIGRAPREG® adhesive films can also be used to bond prepregs to metallic components.
Typical lay-up:
Prepreg → Epoxy resin film → Metal
The surfaces must be suitable for bonding and prepared accordingly. Suitability must be verified for the respective material and application.
Additional resin addition
The film consists entirely of epoxy resin and adds 147 g of resin per m² to the lay-up. It can therefore also be used where an additional, defined quantity of resin is required within a laminate structure.
Whether and to what extent dry reinforcement material can be impregnated in this way depends, among other factors, on the type of reinforcement, areal weight, number of layers, temperature, pressure and processing time. This application should therefore be verified by preliminary trials.
Processing
Cut the material to the required size and remove the protective or backing paper before laminating. If stored at −18 °C, allow the material to reach room temperature before opening the packaging. This prevents condensation from forming on the cold material.
The adhesive film is positioned between the materials to be bonded and then cured together with the complete component under heat and pressure.
For the E322 resin system, SGL Carbon specifies a curing temperature range of 90–140 °C. The specific curing time as well as the temperature and pressure cycle depend on the prepreg used, the component lay-up and the respective manufacturing process.
Processing can be carried out, for example, in a press, a closed mould, under vacuum or, for appropriately designed processes, in an autoclave.
Technical data
| Material type | SIGRAPREG® F 147-E322/100 % |
| Width | 60 cm |
| Areal weight | 147 g/m² |
| Thickness | approx. 150 µm |
| Resin system | Epoxy E322 |
| Resin content | 100 % |
| Glass transition temperature Tg | 120 °C |
| Curing temperature | 90–140 °C |
Storage
At 20 °C: 90 days
At −18 °C: 12 months
Allow material stored frozen to reach room temperature completely before opening the packaging.
Application note:
Curing conditions and process parameters must be adapted to the respective material lay-up. Preliminary trials are recommended for new material combinations or different processing conditions.